CAPABILITIES ​

PTH

PTH in pad (Epoxy Filled)

Blind via

Buried via

Microvia

Unplated holes

Slots

Copper

0.5 oz copper

1 oz copper

2 oz copper

Maximum Copper weight

Maximum layer count

Maximum Board size

Max Board thickness

Features

Other

Scoring

Routing

Laser Routing

Milling

Finish - Thickness range

Silkscreen

We are one of the largest dedicated time and technology HDI printed circuit board manufacturer in the UK. Continuing to push the boundaries with a focus on quality and innovation.

Our Capability cover a wide range of Technologies and Market sectors. We have over 42 years experience regarding R&D to develop new technologies and products.

Some special features exclusive to us such as eXMVT™ (Microvia Tower -10+n+10 where ‘n’ = buried sub core), eXFPT™ (Flat Pad – copper filled umVia’s and thru vias**) and eXVTEX™ (Copper filled thru vias – subject to aspect ratio) along with well known features including differential controlled impedance and blind and buried vias.

Please contact us if you require any further information.

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