CAPABILITIES
PTH
PTH in pad (Epoxy Filled)
Blind via
Buried via
Microvia
Unplated holes
Slots
Copper
0.5 oz copper
1 oz copper
2 oz copper
Maximum Copper weight
Maximum layer count
Maximum Board size
Max Board thickness
Features
Other
Scoring
Routing
Laser Routing
Milling
Finish - Thickness range
Silkscreen
We are one of the largest dedicated time and technology HDI printed circuit board manufacturer in the UK. Continuing to push the boundaries with a focus on quality and innovation.
Our Capability cover a wide range of Technologies and Market sectors. We have over 42 years experience regarding R&D to develop new technologies and products.
Some special features exclusive to us such as eXMVT™ (Microvia Tower -10+n+10 where ‘n’ = buried sub core), eXFPT™ (Flat Pad – copper filled umVia’s and thru vias**) and eXVTEX™ (Copper filled thru vias – subject to aspect ratio) along with well known features including differential controlled impedance and blind and buried vias.
Please contact us if you require any further information.